Method for manufacturing pattern of light shielding layer...

Details Method for manufacturing pattern of light shielding layer... Method for manufacturing pattern of light shielding layer...

2003-04-15

2009-08-04

Huff, Mark F (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S315000, C430S321000, C430S320000, C430S330000, C430S324000, C430S322000

Reexamination Certificate

active

07569330

ABSTRACT:
A method for manufacturing a pattern of a light shielding layer and a patter forming body of light shielding layer. After placing a photocatalyst containing layer side substrate having a base material and a photocatalyst containing layer, and a pattern forming body substrate having a substrate and a property changing layer, the property of an exposed part changes by the action of a photocatalyst in a photocatalyst containing layer, to form a wettability pattern having a lyophilic region and a liquid repellent region on the property changing layer. A light shielding layer composition is coated on the whole surface of the pattern forming body substrate on which the above-mentioned wettability pattern is formed, adhering and solidifying a light shielding layer composition only to the lyophilic region, to form a light shielding layer pattern.

REFERENCES:
patent: 2003/0087073 (2003-05-01), Kobayashi
patent: 2004/0043334 (2004-03-01), Kobayashi et al.
patent: 2000-249821 (2000-09-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing pattern of light shielding layer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing pattern of light shielding layer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing pattern of light shielding layer... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4073729