Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer
Reexamination Certificate
2006-09-25
2009-10-27
Pham, Thanh V. (Department: 2894)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
On insulating substrate or layer
C438S462000, C438S110000, C257S094000, C257S628000
Reexamination Certificate
active
07608525
ABSTRACT:
A method for manufacturing a nitride semiconductor substrate comprises the steps of: growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.
REFERENCES:
patent: 6153010 (2000-11-01), Kiyoku et al.
patent: 6468347 (2002-10-01), Motoki et al.
patent: 2001/0053618 (2001-12-01), Kozaki et al.
patent: 2002/0048909 (2002-04-01), Biwa et al.
patent: 2005/0227458 (2005-10-01), Kobayashi et al.
patent: 1244140 (2002-09-01), None
patent: H11-191657 (1999-07-01), None
patent: 2000-223417 (2000-08-01), None
patent: 2001-102307 (2001-04-01), None
Global IP Counselors, LLP
Henry Caleb
Nichia Corporation
Pham Thanh V.
LandOfFree
Method for manufacturing nitride semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing nitride semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing nitride semiconductor substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4069980