Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-04-27
1988-12-06
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156656, 1566591, 156666, 156902, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
047894237
ABSTRACT:
Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator materil substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.
REFERENCES:
patent: 3340607 (1967-09-01), Shutt
patent: 3344515 (1967-10-01), Schuster et al.
patent: 4354895 (1982-10-01), Ellis
E. I. Du Pont de Nemours and Company
Powell William A.
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