Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-05-08
2007-05-08
Nguyen, Nam (Department: 1753)
Metal working
Method of mechanical manufacture
Electrical device making
C029S850000, C029S853000, C438S460000, C205S125000
Reexamination Certificate
active
10813778
ABSTRACT:
Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for manufacturing a mounting substrate includes the steps of: forming a plurality of electrodes to a mounting substrate, the plurality of electrodes being electrically connected to each other by use of plating wires; energizing the electrodes via the plating wires to coat the electrodes with plated films19by electroplating; and electrically separating the individual electrodes from each other by cutting off the plating wires. Furthermore, the method for manufacturing a circuit device includes, in addition to the foregoing method for manufacturing a mounting substrate, the steps of: fixing a circuit element on the mounting substrate and electrically connecting the electrodes with the circuit element; and forming a sealing resin so as to cover the circuit element.
REFERENCES:
patent: 5042147 (1991-08-01), Tashiro
patent: 6904674 (2005-06-01), Mune et al.
patent: 2004/0164385 (2004-08-01), Kado et al.
Fish & Richardson P.C.
Kanto Sanyo Semiconductors Co., Ltd.
Nguyen Nam
Van Luan V.
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