Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2005-11-29
2005-11-29
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S052000, C438S053000, C438S706000
Reexamination Certificate
active
06969629
ABSTRACT:
A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.
REFERENCES:
patent: 6423563 (2002-07-01), Fukada et al.
patent: 10-190007 (1998-07-01), None
patent: 10-270714 (1998-10-01), None
patent: 2000-31502 (2000-01-01), None
patent: 2003-136497 (2003-05-01), None
Kouma Norinao
Nakamura Yoshitaka
Okuda Hisao
Sawaki Ippei
Soneda Hiromitsu
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Fujitsu Media Devices Limited
Pham Long
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