Method for manufacturing micro-mechanical components using selec

Details Method for manufacturing micro-mechanical components using selec Method for manufacturing micro-mechanical components using selec

1994-09-19

1996-08-06

Fourson, George

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 99, 437228, 437234, 205656, 205661, H01L 21306

Patent

active

055425585

ABSTRACT:
A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.

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W. Lang et al., "Application of Porous Silicon as a Sacrificial Layer," The 7th International Conference on Solid-State Sensors and Actuators, pp. 202-204 (1993).

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