Method for manufacturing metal structure having different...

Details Method for manufacturing metal structure having different... Method for manufacturing metal structure having different...

2006-12-12

2006-12-12

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07148141

ABSTRACT:
Disclosed is a method for forming a plurality of metal structures having different heights on a semiconductor substrate. The disclosed method for manufacturing a metal structure having different heights includes: forming a plurality of seed layers, to have heights corresponding to the metal structure to be formed, on a semiconductor substrate so that those layers can be electrically separated, performing a plating process using a plating mold, and applying different currents to the respective seed layers so that the plating thickness can be adjusted for each of the seed layers. Accordingly, a plurality of metal structures having different heights can be obtained by a plating mold forming process and a plating process that are performed just once, respectively.

REFERENCES:
patent: 2002/0017553 (2002-02-01), Jao
patent: 2003/0080431 (2003-05-01), Uzoh et al.
patent: 2005/0045484 (2005-03-01), Smalley et al.
patent: 10-98268 (1998-04-01), None
patent: 10-135156 (1998-05-01), None
patent: 10135156 (1998-05-01), None

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