Method for manufacturing metal line contact plug of...

Details Method for manufacturing metal line contact plug of... Method for manufacturing metal line contact plug of...

2005-03-08

2005-03-08

Lebentritt, Michael S. (Department: 2824)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S694000, C438S750000, C438S754000

Reexamination Certificate

active

06864177

ABSTRACT:
A method for manufacturing of a metal line contact plug of a semiconductor device by performing a two step CMP process using (1) a first slurry solution having high etching selectivity of metal/insulating film and (2) a second slurry solution having small etching selectivity of metal/insulating film, thereby minimizing dependency on CMP devices and separating easily a metal line contact plug.

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Korean Intellectual Property Office Notice of Rejection dated Oct. 27, 2003.

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