Method for manufacturing MEMS structures

Details Method for manufacturing MEMS structures Method for manufacturing MEMS structures

2007-02-13

2007-02-13

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S725000

Reexamination Certificate

active

10769346

ABSTRACT:
A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.

REFERENCES:
patent: 6818384 (2004-11-01), Choi et al.
patent: 2002/0155389 (2002-10-01), Rangarajan et al.
patent: 2003/0129543 (2003-07-01), Hwang et al.

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