Method for manufacturing indium gallium aluminium nitride...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S551000, C438S552000, C438S553000, C438S555000, C438S671000, C257SE21121, C257SE21125, C257SE21127, C257SE21131

Reexamination Certificate

active

07615420

ABSTRACT:
The method for manufacturing the indium gallium aluminium nitride (InGaAlN) thin film on silicon substrate, which comprises the following steps: introducing magnesium metal for processing online region mask film, that is, or forming one magnesium mask film layer or metal transition layer; then forming one metal transition layer or magnesium mask layer, finally forming one layer of indium gallium aluminium nitride semiconductor layer; or firstly forming one layer of metal transition layer on silicon substrate and then forming the first indium gallium aluminium nitride semiconductor layer, magnesium mask layer and second indium gallium aluminium nitride semiconductor layer in this order. This invention can reduce the dislocation density of indium gallium aluminium nitride materials and improve crystal quality.

REFERENCES:
patent: 5152805 (1992-10-01), Geddes et al.
patent: 6955932 (2005-10-01), Hovel et al.

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