Method for manufacturing GaN-based film LED

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Plural fluid growth steps with intervening diverse operation

Reexamination Certificate

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Details

C438S028000, C438S032000, C438S033000, C438S492000, C438S504000, C257SE21099, C257SE21112, C257SE21461, C117S097000, C117S104000

Reexamination Certificate

active

07955959

ABSTRACT:
A method for manufacturing GaN-based film LED based on masklessly transferring photonic crystal structure is disclosed. Two dimensional photonic crystals are formed on a sapphire substrate. Lattice quality of GaN-based epitaxy on the sapphire substrate is improved, and the internal quantum efficiency of GaN-based LED epitaxy is increased. After the GaN-based film is transferred onto heat sink substrate, the two dimensional photonic crystals structure is masklessly transferred onto the light exiting surface of the GaN-based film by using different etching rates between the GaN material and the SiO2 mask, so that light extraction efficiency of the GaN-based LED is improved. That is, the GaN-based film LED according to the invention has a relatively high illumination efficiency and heat sink.

REFERENCES:
patent: 2010/0283075 (2010-11-01), McKenzie et al.
Chang et al., “Improved ESD protection by combining InGaN-GaN MQW LEDs with GaN Schottky diodes,”IEEE Electron Device Letters, 24:129-131, 2003.

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