Method for manufacturing gallium nitride group compound...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

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C438S482000, C438S483000, C438S479000, C438S778000, C438S779000

Reexamination Certificate

active

06893945

ABSTRACT:
An Al0.15Ga0.85N layer2is formed on a silicon substrate1in a striped or grid pattern. A GaN layer3is formed in regions A where the substrate1is exposed and in regions B which are defined above the layer2. At this time, the GaN layer grows epitaxially and three-dimensionally (not only in a vertical direction but also in a lateral direction) on the Al0.15Ga0.85N layer2. Since the GaN layer grows epitaxially in the lateral direction as well, a GaN compound semiconductor having a greatly reduced number of dislocations is obtained in lateral growth regions (regions A where the substrate1is exposed).

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