Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-02-28
2006-02-28
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S122000, C438S124000, C438S612000, C438S613000, C438S614000
Reexamination Certificate
active
07005320
ABSTRACT:
A method for manufacturing a flip chip package includes preparing an IC chip that includes an active surface on which electrode pads are formed, attaching a heat dissipater to a backside of the IC chip with a thermal interface material (TIM), providing a flux filler layer on a substrate, where the substrate includes a plurality of land pads each corresponding to each of the plurality of electrode pads, and mounting the IC chip to the substrate with the active surface facing the substrate. The method further includes forming metal connectors on each of the corresponding plurality of electrode pads of the IC chip, and forming an electrical interconnection between the land pads of the substrate and the plurality of metal connectors by soldering the metal connectors to the land pads. The heat dissipator may be a hermetic heat spreader having a pair of opposite ends bent toward the substrate, which are hermetically sealed to the substrate.
REFERENCES:
patent: 3651562 (1972-03-01), Hambleton
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5477082 (1995-12-01), Buckley et al.
patent: 5528462 (1996-06-01), Pendse
patent: 5583073 (1996-12-01), Lin et al.
patent: 5744869 (1998-04-01), Root
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5785799 (1998-07-01), Culnane et al.
patent: 5835355 (1998-11-01), Dordi
patent: 6118177 (2000-09-01), Lischner et al.
patent: 6121070 (2000-09-01), Akram
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6194788 (2001-02-01), Gilleo et al.
patent: 6229831 (2001-05-01), Nightingale et al.
patent: 6486562 (2002-11-01), Kato
patent: 6615484 (2003-09-01), Kirsten
patent: 2002/0175403 (2002-11-01), Sreeram et al.
Harness Dickey & Pierce
Samsung Electronics Co,. Ltd.
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