Method for manufacturing flash memory device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S706000, C438S745000, C438S509000, C257S296000, C257SE21006, C257SE21027, C257SE21043, C257SE21077, C257SE21215, C257SE21229, C257SE21245, C257SE21248, C257SE21267, C257SE21278, C257SE21293, C257SE21645

Reexamination Certificate

active

08003531

ABSTRACT:
A method for manufacturing a flash memory device is capable of controlling a phenomenon in which a length of the channel between a source and a drain is decreased due to undercut. The method includes forming a gate electrode comprising a floating gate, an ONO film and a control gate using a hard mask pattern over a semiconductor substrate, forming a spacer over the sidewall of the gate electrode, forming an low temperature oxide (LTO) film over the entire surface of the semiconductor substrate including the gate electrode and the spacer, etching the LTO film such that a top portion of the source/drain region and a top portion of the gate electrode are exposed, and removing the LTO film present over the sidewall of the gate electrode by wet-etching.

REFERENCES:
patent: 7772676 (2010-08-01), Han et al.
patent: 2005/0214996 (2005-09-01), Yoshino
patent: 2007/0057324 (2007-03-01), Tews et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing flash memory device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing flash memory device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing flash memory device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2721090

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.