Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-11-28
2006-11-28
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S778000, C257SE21240
Reexamination Certificate
active
07141515
ABSTRACT:
A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat.The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.
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Wolf et al. Silicon Processing for the VLSI Era, vol. 1,Lattice Press Sunset Beach, CA, 1986, pp. 407-409.
Matsui Jun
Nakata Hidehiko
Lebentritt Michael
Lee Cheung
Staas & Halsey , LLP
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