Method for manufacturing device

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S778000, C257SE21240

Reexamination Certificate

active

07141515

ABSTRACT:
A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat.The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.

REFERENCES:
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patent: 6395446 (2002-05-01), Seki et al.
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patent: 7-33855 (1995-02-01), None
patent: 10-142438 (1998-05-01), None
patent: 2002-30420 (2002-01-01), None
patent: 2004-535829 (2005-03-01), None
patent: WO 03/012081 (2003-02-01), None
Wolf et al. Silicon Processing for the VLSI Era, vol. 1,Lattice Press Sunset Beach, CA, 1986, pp. 407-409.

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