Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2002-08-21
2004-05-25
Tucker, Philip (Department: 1712)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S621000, C427S098300, C427S306000, C205S126000, C205S169000, C205S187000
Reexamination Certificate
active
06740425
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing copper-resin composite materials. In addition, the present invention relates to a copper-resin composite intermediate material used in the aforementioned method for manufacturing copper-resin composite materials.
In the past, when manufacturing copper-resin composite materials such as printed circuit boards, copper-resin composite intermediate materials have been used which are composed of a copper thin film on a resin substrate. In the process whereby the target copper-resin composite material is to be manufactured, the copper-resin composite intermediate material is subjected to an electrolytic copper plating treatment or pattern formation process.
One method for manufacturing this type of copper-resin composite intermediate material involves affixing palladium or palladium-tin catalyst onto the resin substrate, and then carrying out treatment with an electroless copper plating bath containing copper ions and reducing agent, without subjecting said catalyst to an acceleration treatment using sulfuric acid, etc. The copper-resin composite intermediate material manufactured by means of this method has a copper thin film that is more uniform and fine-grained than is obtained by common electroless copper plating methods (in this specification, the term “common electroless copper plating methods” refers to methods in which the palladium-tin catalyst is subjected to an acceleration treatment with sulfuric acid, etc., followed by the formation of a copper thin film by treatment in a bath containing copper ions and formaldehyde). In addition, there are the advantages that the deposition rate of electrolytic copper is faster during the electrolytic copper plating treatment, and the deposited electrolytic copper is more uniform and fine-grained relative to cases where the base is a copper thin film formed by a common electrolytic copper plating treatment.
In ordinary copper-resin composite material manufacture processes, a material that has been manufactured and stored is used as the copper-resin composite intermediate material. In such cases, an oxide film is formed on the copper thin film surface during the time when the copper-resin composite intermediate material is stored, and when an electrolytic copper plating treatment is then carried out directly on this oxide film, there is the disadvantage that separation of the copper layer in the resulting copper-resin composite material readily occurs. For this reason, when a copper-resin composite intermediate material is to be subjected to electrolytic copper plating, ordinarily, a degreasing treatment, or degreasing treatment followed by an etching treatment, is carried out to remove the oxide film prior to the electrolytic copper plating treatment. In addition, it is necessary to carry out a similar treatment not only when oxide film has been formed, but even when the copper thin film has been contaminated with other materials. Contaminants can thereby be removed.
When the copper-resin composite material is to be subjected to a patterning treatment, a resist layer is formed on the copper thin film of the copper-resin composite intermediate material, and the patterning treatment is carried out. In this case, the copper thin film is ordinarily subjected to an etching treatment or polishing treatment in order to improve binding between the resist layer and copper thin film.
As described above, copper-resin composite intermediate materials used as intermediate materials in the manufacture of copper-resin composite materials are often subjected to a degreasing treatment, etching treatment or polishing treatment, and so a material is desired that can withstand these treatments.
In common electrolytic copper plating methods in which palladium-tin catalyst is subjected to an acceleration treatment in a solution having sulfuric acid or other such substance as a base, and a copper thin film is then formed by treatment with a bath containing copper ions and formaldehyde, it is possible to use a thick electroless copper plating method to form a deposited copper thin film at a thickness that can withstand the degreasing treatment, etching treatment or polishing treatment (1.5-2.5 &mgr;m).
However, with copper-resin composite intermediate materials manufactured by means of affixing palladium or palladium-tin catalyst to resin substrate, and treating this material in an electroless copper plating bath containing copper ions and reducing agent, without subjecting said catalyst to an acceleration treatment using a solution having sulfuric acid or other such substance as a base, the copper thin film has a film thickness of about 0.08 &mgr;m or less when said electroless copper plating bath does not contain formaldehyde, and there are cases where the copper thin film will not withstand an etching treatment. For this reason, when manufacturing a copper-resin composite intermediate material by the above method, there are cases where there are disadvantages of separation of the electrolytic copper plating layer and insufficient pattern formation.
In addition, in methods in which palladium or palladium-tin catalyst is affixed to the resin substrate, and treatment is carried out with an electroless copper plating bath containing copper ions and reducing agent, without subjecting said catalyst to an acceleration treatment using a solution having sulfuric acid or other such substance as a base, it is possible to manufacture a copper-resin composite intermediate material with a copper thin film thickness of about 0.08 &mgr;m or greater when the plating bath containing copper ions and reducing agent contains formaldehyde. However, a long period of time is required for the formation of a copper thin film of sufficient thickness to withstand the etching treatment or polishing treatment for the copper-resin composite intermediate material.
SUMMARY OF THE INVENTION
The present invention attempts to solve new problems of the type described above that are not present in ordinary common electrolytic copper plating methods, but have arisen with the development of electroless copper plating methods in which palladium or palladium-tin catalyst is affixed to the resin substrate, and treatment is carried out with an electroless copper plating bath containing copper ions and reducing agent, without subjecting said catalyst to an acceleration treatment using a solution containing sulfuric acid or other such substance as a base.
Specifically, the present invention provides a copper-resin composite intermediate material that can withstand etching treatment or polishing treatment subsequent to an electrolytic copper plating treatment carried out prior to the formation of an oxide film on the copper thin film, where this copper thin film is formed on a resin substrate by affixing palladium or palladium-tin catalyst to the resin substrate, followed by treatment with an electroless copper plating bath containing copper ions and reducing agent to form a copper thin film on the resin substrate, without subjecting said catalyst to an acceleration treatment using a solution containing sulfuric acid or other substance as a base. In addition, the present invention provides a method for manufacturing copper-resin composite materials that includes a process for manufacturing said copper-resin composite intermediate material, where the production costs and treatment time are reduced relative to thick electrolytic copper plating treatments.
The present invention relates to a method for forming copper-resin composite materials, comprising 1) affixing palladium or palladium-tin catalyst onto resin substrate, 2) treating a resin substrate with affixed catalyst with an electroless copper plating bath containing copper ions and reducing agent, without performing a catalyst acceleration treatment, thereby forming a copper thin film on the resin substrate, 3) subjecting the resin substrate having said copper thin film to an electrolytic copper plating treatment prior to the formation of oxide film on the coppe
Imanari Masaaki
Seita Masaru
Sugita Yoshihiro
Tsuchida Hideki
Cairns S. Matthew
Feely Michael J
Shipley Company L.L.C.
Tucker Philip
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