Method for manufacturing compound semiconductor field-effect tra

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

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438174, 438518, H01L 21338

Patent

active

060837810

ABSTRACT:
A method for making compound semiconductor devices including the use of a p-type dopant is disclosed wherein the dopant is co-implanted with an n-type donor species at the time the n-channel is formed and a single anneal at moderate temperature is then performed. Also disclosed are devices manufactured using the method. In the preferred embodiment n-MESFETs and other similar field effect transistor devices are manufactured using C ions co-implanted with Si atoms in GaAs to form an n-channel. C exhibits a unique characteristic in the context of the invention in that it exhibits a low activation efficiency (typically, 50% or less) as a p-type dopant, and consequently, it acts to sharpen the Si n-channel by compensating Si donors in the region of the Si-channel tail, but does not contribute substantially to the acceptor concentration in the buried p region. As a result, the invention provides for improved field effect semiconductor and related devices with enhancement of both DC and high-frequency performance.

REFERENCES:
patent: 4905061 (1990-02-01), Ohmuro et al.
Davies et al., "Anomalous Behaviour of Carbon Implants in Si-doped GaAs", Int. Sum. GaAs and Related Compounds, No. 112, Chap. 5, pp 275-280, 1990.
Gwilliam et al., "The use of Multi-Species Implantation for Carrier Profile Control in GaAs MESFETs Fabricated Using Silicon Ion Implantation", Nucl. Instr. and Methods, B74, pp. 94-97, 1993.

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