Method for manufacturing circuit devices

Details Method for manufacturing circuit devices Method for manufacturing circuit devices

2006-05-16

2006-05-16

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S612000

Reexamination Certificate

active

07045393

ABSTRACT:
Conventionally, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate (10) in which a thin first conductive film (11) and a thick second conductive film (12) have been laminated via a third conductive film (13) is used. In a step for forming a conductive wiring layer (11A) by etching the first conductive film (11), etching depth can be controlled by stopping etching at the third conductive film (13). Accordingly, forming the first conductive film (11) to be thin makes it possible to form the conductive wiring layer (11A) into a fine pattern.

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