Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-07-02
1983-06-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156151, 156634, 1566611, 156902, 204 15, 427 97, 430315, C25D 502, B05D 512, C23F 102, B44C 122
Patent
active
043892787
ABSTRACT:
A method for manufacturing a circuit board with through hole, by taking the processing steps of: forming a preferred wire distribution pattern by selectively etching the two-side copper-clad laminate; piercing holes to be used as the through holes at the specified locations; masking the surface of the board except the through hole portion by using the conductive ink and the pH-resistant ink; forming the conductive film over the through hole by the electroless plating; forming the metal foil with appropriate thickness over the conductive film by the electroplating, by using the conductive ink layer as the electrode at one end; and finally, removing the conductive ink and the pH-resistant ink.
REFERENCES:
patent: 3457638 (1969-07-01), Johnson
patent: 3799802 (1974-03-01), Schneble et al.
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4211603 (1980-07-01), Reed
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