Method for manufacturing capacitive sensor, and capacitive...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C438S381000, C257S416000

Reexamination Certificate

active

07928519

ABSTRACT:
In the method for manufacturing a capacitance sensor according to the present invention, after a protection layer is pattern-formed on the surface of a silicon substrate, a first metal layer is formed on the surface of a silicon substrate so as to be opposed to a protection layer non-formed area on which no protection layer is formed and to expose a part of the protection layer non-formed area. After that, a first insulation layer, a metal sacrificing layer, and a second insulation layer, and a second metal layer are formed on the first metal layer in this order. Then, the metal sacrificing layer is removed by supplying a metal etching solution on the metal sacrificing layer. Further, a part of the silicon substrate is removed by supplying a silicon etching solution to the silicon substrate from the portion, from which the metal sacrificing layer is removed, via the protection layer non-formed area exposed by the removal of the metal sacrificing layer.

REFERENCES:
patent: 6731766 (2004-05-01), Yasuno et al.
patent: 7301213 (2007-11-01), Matsubara et al.
patent: 2007/0058825 (2007-03-01), Suzuki et al.
patent: 2007/0071261 (2007-03-01), Matsuzawa
patent: 2007/0236310 (2007-10-01), Fazzio et al.

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