Method for manufacturing camera module where a solid state...

Television – Camera – system and detail – Optics

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07570297

ABSTRACT:
A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.

REFERENCES:
patent: 4942539 (1990-07-01), McGee et al.
patent: 5749827 (1998-05-01), Minami
patent: 6156587 (2000-12-01), Kayanuma et al.
patent: 6476417 (2002-11-01), Honda et al.
patent: 6727564 (2004-04-01), Shinomiya
patent: 6762796 (2004-07-01), Nakajoh et al.
patent: 7074638 (2006-07-01), Maeda et al.
patent: 7242433 (2007-07-01), Tanaka et al.
patent: 7333147 (2008-02-01), Adachi et al.
patent: 7391457 (2008-06-01), Fujimoto et al.
patent: 2001/0050721 (2001-12-01), Miyake
patent: 2001/0055073 (2001-12-01), Shinomiya
patent: 2002/0167605 (2002-11-01), Akimoto et al.
patent: 2003/0025825 (2003-02-01), Nakajoh
patent: 2003/0057359 (2003-03-01), Webster
patent: 2003/0164891 (2003-09-01), Akimoto
patent: 2004/0223072 (2004-11-01), Maeda et al.
patent: 0 773 673 (1997-05-01), None
patent: 1 148 716 (2001-10-01), None
patent: 5-102448 (1993-04-01), None
patent: 11-252416 (1999-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing camera module where a solid state... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing camera module where a solid state..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing camera module where a solid state... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4114064

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.