Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1996-08-09
1998-11-17
Baxter, Janet C.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430313, 430324, 430329, 427 98, G03C 500, B05D 512
Patent
active
058374272
ABSTRACT:
A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip size package) or portable phones. In the build-up multi-layer printed circuit board of the present invention, an inner-layer connecting state is improved. The multi-layer printed circuit board is manufactured by sequentially stacking insulating resin layers and circuit conductor layers based on a build-up method. That is, a first insulating resin layer is necessarily made to undergo an exposure and a development so as to form a first via hole 122. Then a second via hole 124 which is larger than the first via hole 122 is formed on a second insulating resin layer, thereby forming a final V shaped photo via hole 120. Thus build-up multi-layer printed circuit board is manufactured.
REFERENCES:
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 5261154 (1993-11-01), Ferrier et al.
patent: 5289630 (1994-03-01), Ferrier et al.
patent: 5635337 (1997-06-01), Bartha et al.
Hwang Se Meyung
Park Keon Yang
Shin Young Hwan
Ashton Rosemary
Baxter Janet C.
Samsung Electro-Mechanics Co Co., Ltd.
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