Etching a substrate: processes – Forming or treating electrical conductor article – Adhesive or autogenous bonding of self-sustaining preforms
Reexamination Certificate
2005-11-23
2011-11-22
Norton, Nadine G (Department: 1713)
Etching a substrate: processes
Forming or treating electrical conductor article
Adhesive or autogenous bonding of self-sustaining preforms
C029S830000
Reexamination Certificate
active
08062537
ABSTRACT:
Method for manufacturing an electronic module, which electronic module includes a component (6), which has contact areas (17), which are connected electrically to a conductor-pattern layer (14). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer (4) and an insulator layer (10) on the first surface of the conductor layer (4). Contact openings (17), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6), and which penetrate both the conductor layer (4) and the insulator layer (10), are made in the membrane. After the manufacture of the contact openings (17), the component (6) is attached to the surface of the insulator layer (10), in such a way that the contact areas (7) of the component (6) line up next to the contact openings (17). After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made, which connects the component (6) to the conductor layer (4) and the conductor layer (4) is patterned to form a conductor-pattern layer (14).
REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 5302851 (1994-04-01), Ree et al.
patent: 5838545 (1998-11-01), Clocher et al.
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6242282 (2001-06-01), Fillion et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6284564 (2001-09-01), Balch et al.
patent: 6475877 (2002-11-01), Saia et al.
patent: 6596968 (2003-07-01), Yamamoto et al.
patent: 7294529 (2007-11-01), Tuominen
patent: 7673387 (2010-03-01), Tuominen et al.
patent: 2002/0017711 (2002-02-01), Kwon et al.
patent: 2003/0068852 (2003-04-01), Towle et al.
patent: 2006/0278967 (2006-12-01), Tuominen et al.
patent: 20030493 (2004-10-01), None
patent: 4-283987 (1992-10-01), None
patent: 2002-158307 (2002-05-01), None
patent: WO-03/065778 (2003-08-01), None
patent: WO03/065779 (2003-08-01), None
patent: WO-2004/089048 (2004-10-01), None
Iihola Antti
Tuominen Risto
Birch & Stewart Kolasch & Birch, LLP
Imbera Electronics Oy
Lin Patti
Norton Nadine G
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