Method for manufacturing an electronic circuit device and...

Details Method for manufacturing an electronic circuit device and... Method for manufacturing an electronic circuit device and...

2007-02-20

2007-02-20

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S108000, C257SE23179

Reexamination Certificate

active

10901750

ABSTRACT:
A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.

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