Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1997-04-29
1999-07-27
Powell, William
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
216 17, B44C 122
Patent
active
059285265
ABSTRACT:
A method and apparatus for a substrate having an irregular shape is provided. Using a laser, a first series of laser drilled wells, having a first spacing, are made in the substrate material to define a substantial portion of the perimeter of the irregular shaped substrate. a second series of laser drilled wells, having a second spacing are made in the substrate material to form the remaining portion of the perimeter of the irregular shaped substrate. The second series of laser drilled wells form a "tab" which provides a more rigid tack to the substrate material thereby giving greater adhesion of the substrate to the panel of substrate material, wherein the irregular shaped substrate is retained in the panel of substrate material without breaking. Upon completion of processing, the irregular shaped substrates are easily removed from the panel. Also provided is an irregular shaped substrate comprising a substrate having a perimeter with at least one rounded corner and wherein the perimeter does not substantially form a square.
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patent: 5116641 (1992-05-01), Patel et al.
patent: 5676855 (1997-10-01), Schulz-Harder
Freyman, B.J., "Laser Drilling of Alumina Substrates for Thin Film Applications", Motorola Portable Products Division, Ft. Lauderdale, FL, pp. 596-601.
Siekman J.G., "Analysis of Laser Drilling and Cutting Results in AI.sub.2 O.sub.3 and Ferrites", American Institute of Physics, pp. 225-231.
Kugler, T. R., et al., "Ceramic Machining and Scribing Systems", presented at Laser in Electronics Manufacturing, Apr. 29-May 1, 1986, The Hyatt San Jose, San Jose, California.
Ishimaru Mikio
Powell William
Stellex Microwave Systems, Inc.
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