Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-04-16
1997-12-30
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29593, 29830, 29846, 29850, 324754, 437 8, H05K 310, H01L 2166, G01R 3102, G01R 3128
Patent
active
057016666
ABSTRACT:
A method, apparatus, and circuit distribution wafer (CDW) (16) are used to wafer-level test a product wafer (14) containing one or more product integrated circuits (ICs). The CDW (16) contains circuitry which is used to test the ICs on the product wafers (14). A connection from the product wafer (14) to the CDW (16) is made via a compliant interconnect media (IM) (18). Through IM (18), the CDW (16) tests the product wafer (14) under any set of test conditions. Through external connectors and conductors (20, 22, 24, and 26) the CDW (16) transmits and receives test data, control information, temperature control, and the like from an external tester (104). To improve performance and testability, the CDW (16) and heating/cooling (80 and 82) of the wafers may be segmented into two or more wafer sections for greater control and more accurate testing.
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Intel Corporaation, Intel486.TM. DX Microprocessor Data Book, Jun. 1991, pp. 127-141, Order No.: 240440-004.
DeHaven Robert Keith
Wenzel James F.
Motorola Inc.
Vo Peter
Witek Keith E.
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