Method for manufacturing a semiconductor package

Details Method for manufacturing a semiconductor package Method for manufacturing a semiconductor package

1995-08-10

1998-01-20

Niebling, John

Fishing, trapping, and vermin destroying

437207, 437217, 257666, 257671, H01L 2160

Patent

active

057100640

ABSTRACT:
A method for manufacturing a semiconductor package, including providing a lead frame in which die pad and side rail areas of the lead frame are mechanically interconnected to, and electrically isolated from each other so that the exposed bottom surface of the die pad does not become coated with a metal plating film during surface treatment for coating outer leads of the lead frame.

REFERENCES:
patent: 4992628 (1991-02-01), Beppu et al.
patent: 5042147 (1991-08-01), Tashiro
patent: 5084753 (1992-01-01), Goida et al.
patent: 5138430 (1992-08-01), Gow, 3rd et al.
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5347709 (1994-09-01), Maejima et al.
patent: 5394607 (1995-03-01), Chiu et al.
patent: 5459103 (1995-10-01), Kelleher et al.
patent: 5471011 (1995-11-01), Maslakow
patent: 5539251 (1996-07-01), Iverson et al.

Affiliated with

Also associated with

Rating

Method for manufacturing a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-724911