Method for manufacturing a semiconductor device with ion implant

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438162, 438288, 438289, H01L 310392, H01L 31113

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active

060514523

ABSTRACT:
A silicon oxide layer serving as an insulation layer is formed on a p-type semiconductor substrate. An n.sup.+ -type source and drain regions are formed on the p-type substrate 110 with a spacing therebetween. A channel region is interposed between the source and drain regions. A silicon oxide layer serving as an insulation layer is formed on the channel region. A gate terminal is formed on the silicon oxide layer. High-concentration p-type regions are formed in the p-type semiconductor substrate under the source and drain regions, respectively.

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An Analysis of the Concave MOSFET, by Kenhi Natori et al, IEEE Transactions On Electron Devices, vol. Ed. 35, No. 4, Apr., 1978, pp. 448-456.

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