Method for manufacturing a semiconductor device including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S303000, C257S351000, C257S379000, C438S200000, C438S210000

Reexamination Certificate

active

07064369

ABSTRACT:
In a method for fabricating a semiconductor device including a PIP capacitor and a MOS transistor, an isolator film is formed on a semiconductor substrate and then etched to expose an active region of the substrate. An epitaxial film is then formed by performing a selective epitaxial silicon growth process on the active region. A first polysilicon film, a dielectric film and a second polysilicon film are then sequentially formed. Next, an upper electrode is created by patterning the second polysilicon film. After a lower electrode and a gate electrode are formed by patterning the first polysilicon film, a source and a drain of a source/drain region are formed into the epitaxial film. Subsequently, after an interlayer insulation film is created on a resultant structure, contact holes are formed thereinto and contacts connected to the upper electrode, the lower electrode, the gate electrode and the source/drain region are formed.

REFERENCES:
patent: 5231053 (1993-07-01), Bost et al.
patent: 5731236 (1998-03-01), Chou et al.
patent: 5838049 (1998-11-01), Nicholls et al.
patent: 5924011 (1999-07-01), Huang
patent: 5973346 (1999-10-01), Pan
patent: 6284594 (2001-09-01), Ju et al.

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