Method for manufacturing a semiconductor device including...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S029000, C438S034000, C438S039000, C438S045000, C257SE33053

Reexamination Certificate

active

07459354

ABSTRACT:
The crystallization method by laser light irradiation forms a multiplicity of convexes (ridges) in the surface of an obtained crystalline semiconductor film, deteriorating film quality. Therefore, it is a problem to provide a method for forming a ridge-reduced semiconductor film and a semiconductor device using such a semiconductor film. The present invention is characterized by heating a semiconductor film due to a heat processing method (RTA method: Rapid Thermal Anneal method) to irradiate light emitted from a lamp light source after crystallizing the semiconductor film by laser light, thereby reducing the ridge.

REFERENCES:
patent: 4256681 (1981-03-01), Lindmayer
patent: 4814292 (1989-03-01), Sasaki et al.
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5619044 (1997-04-01), Makita et al.
patent: 5627084 (1997-05-01), Yamazaki et al.
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5771110 (1998-06-01), Hirano et al.
patent: 5773327 (1998-06-01), Yamazaki et al.
patent: 5824573 (1998-10-01), Zhang et al.
patent: 5854096 (1998-12-01), Ohtani et al.
patent: 5879977 (1999-03-01), Zhang et al.
patent: 5904770 (1999-05-01), Ohtani et al.
patent: 5907770 (1999-05-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5923997 (1999-07-01), Mitanaga et al.
patent: 5938839 (1999-08-01), Zhang
patent: 5939731 (1999-08-01), Yamazaki et al.
patent: 5948496 (1999-09-01), Kinoshita et al.
patent: 5953597 (1999-09-01), Kusumoto et al.
patent: 6013544 (2000-01-01), Makita et al.
patent: 6014944 (2000-01-01), Aklufi et al.
patent: 6066516 (2000-05-01), Miyasaka
patent: 6066547 (2000-05-01), Maekawa
patent: 6133075 (2000-10-01), Yamazaki et al.
patent: 6184068 (2001-02-01), Ohtani et al.
patent: 6197623 (2001-03-01), Joo et al.
patent: 6232622 (2001-05-01), Hamada
patent: 6249330 (2001-06-01), Yamaji et al.
patent: 6281057 (2001-08-01), Aya et al.
patent: 6285042 (2001-09-01), Ohtani et al.
patent: 6319761 (2001-11-01), Zhang et al.
patent: 6326248 (2001-12-01), Ohtani et al.
patent: 6335541 (2002-01-01), Ohtani et al.
patent: 6455360 (2002-09-01), Miyasaka
patent: 6489632 (2002-12-01), Yamazaki et al.
patent: 6500704 (2002-12-01), Hirano et al.
patent: 6509579 (2003-01-01), Takeya et al.
patent: 6524896 (2003-02-01), Yamazaki et al.
patent: 6548370 (2003-04-01), Kasahara et al.
patent: 6559036 (2003-05-01), Ohtani et al.
patent: 6566179 (2003-05-01), Murley et al.
patent: 6747289 (2004-06-01), Yamazaki et al.
patent: 6790714 (2004-09-01), Hirano et al.
patent: 6864127 (2005-03-01), Yamazaki et al.
patent: 6872638 (2005-03-01), Yamazaki et al.
patent: 6911698 (2005-06-01), Yamazaki et al.
patent: 6995432 (2006-02-01), Yamazaki et al.
patent: 7084016 (2006-08-01), Yamazaki et al.
patent: 7084052 (2006-08-01), Hirano et al.
patent: 7126161 (2006-10-01), Yamazaki
patent: 7151015 (2006-12-01), Suzawa et al.
patent: 7160784 (2007-01-01), Yamazaki et al.
patent: 7161177 (2007-01-01), Suzawa et al.
patent: 7186600 (2007-03-01), Ohtani et al.
patent: 7192813 (2007-03-01), Yamazaki et al.
patent: 7282398 (2007-10-01), Yamazaki et al.
patent: 2001/0003659 (2001-06-01), Aya et al.
patent: 2002/0119585 (2002-08-01), Yamazaki et al.
patent: 2002/0119633 (2002-08-01), Yamazaki et al.
patent: 2002/0127827 (2002-09-01), Yamazaki et al.
patent: 2002/0146868 (2002-10-01), Miyasaka
patent: 2003/0089909 (2003-05-01), Miyairi et al.
patent: 2005/0158930 (2005-07-01), Yamazaki et al.
patent: 2005/0250266 (2005-11-01), Yamazaki et al.
patent: 2006/0276012 (2006-12-01), Yamazaki et al.
patent: 2007/0012921 (2007-01-01), Yamazaki
patent: 2007/0111424 (2007-05-01), Suzawa et al.
patent: 2007/0120189 (2007-05-01), Yamazaki et al.
patent: 0 651 431 (1995-05-01), None
patent: 61-064119 (1986-04-01), None
patent: 63-207125 (1988-08-01), None
patent: 02-170524 (1990-07-01), None
patent: 03-089517 (1991-04-01), None
patent: 04-340724 (1992-11-01), None
patent: 06-163409 (1994-06-01), None
patent: 07-183540 (1995-07-01), None
patent: 08-008206 (1996-01-01), None
patent: 08-051215 (1996-02-01), None
patent: 08-255916 (1996-10-01), None
patent: 09-051100 (1997-02-01), None
patent: 09-090425 (1997-04-01), None
patent: 09-156916 (1997-06-01), None
patent: 09-162121 (1997-06-01), None
patent: 09-162124 (1997-06-01), None
patent: 09-213630 (1997-08-01), None
patent: 09-293870 (1997-11-01), None
patent: 10-106951 (1998-04-01), None
patent: 10-116989 (1998-05-01), None
patent: 10-301147 (1998-11-01), None
patent: 11-074536 (1999-03-01), None
patent: 11-109406 (1999-04-01), None
patent: 2000-058860 (2000-02-01), None
patent: 2000-082823 (2000-03-01), None
patent: 2000-114172 (2000-04-01), None
patent: 2000-114173 (2000-04-01), None
patent: 2000-114526 (2000-04-01), None
patent: 2000-114527 (2000-04-01), None
patent: 2000-114529 (2000-04-01), None
patent: 2000-150890 (2000-05-01), None
patent: 2000-196101 (2000-07-01), None
patent: 2000-208417 (2000-07-01), None
patent: 2000-260710 (2000-09-01), None
patent: 2001-035790 (2001-02-01), None
patent: 2002-076349 (2002-03-01), None
Abe et al., “High-Performance Poly-Crystalline Silicon TFTs Fabricated Using the SPC and ELA Methods,” AM-LCD 98 Digest of Technical Papers, pp. 85-88.
Kimura et al., “Device Simulation of Interface Roughness in Laser-Crystallized p-Si TFTs,” AM-LCD 1999, pp. 263-266.

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