Method for manufacturing a semiconductor device

Details Method for manufacturing a semiconductor device Method for manufacturing a semiconductor device

2011-03-29

2011-03-29

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S112000, C257SE21502

Reexamination Certificate

active

07915090

ABSTRACT:
A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, comprises; mounting a plurality of semiconductor elements on the substrate in the X-axial direction and the Y-axial direction, forming marks in the X-axial direction, supplying the sealing material onto the substrate to continuously-covering the plurality of semiconductor elements arranged in the X-axial direction along the marks, dicing the sealing member and the substrate in the Y-axial direction to form cut planes of the sealing member and the substrate in substantially one plane and being a pair of cut planes opposite one another.

REFERENCES:
patent: H07-211843 (1995-08-01), None
patent: 2000-196000 (2000-07-01), None
patent: 2000-277809 (2000-10-01), None
patent: 2000-353825 (2000-12-01), None
patent: 2001-223285 (2001-08-01), None
patent: 2004-363171 (2004-12-01), None
patent: 2006-229055 (2006-08-01), None

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