Method for manufacturing a semiconductor device

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S542000, C438S787000, C438S795000, C257S072000, C257S075000, C257SE21297, C257SE21370, C257SE21413

Reexamination Certificate

active

07998844

ABSTRACT:
A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treating the amorphous silicon film thereafter to crystallize the film.

REFERENCES:
patent: 3108914 (1963-10-01), Hoerni
patent: 3389024 (1968-06-01), Schimmer
patent: 3783049 (1974-01-01), Sandera
patent: 3988762 (1976-10-01), Cline et al.
patent: 4068020 (1978-01-01), Reuschel
patent: 4309224 (1982-01-01), Shibata
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 4472458 (1984-09-01), Sirinyan et al.
patent: 4534820 (1985-08-01), Mori et al.
patent: 4623912 (1986-11-01), Chang et al.
patent: 4746628 (1988-05-01), Takafuji et al.
patent: 4766477 (1988-08-01), Nakagawa et al.
patent: 4801351 (1989-01-01), Awane et al.
patent: 4911781 (1990-03-01), Fox et al.
patent: 4933298 (1990-06-01), Hasegawa
patent: 4959247 (1990-09-01), Moser et al.
patent: 5010033 (1991-04-01), Tokunaga et al.
patent: 5075259 (1991-12-01), Moran
patent: 5130103 (1992-07-01), Yamagata et al.
patent: 5130264 (1992-07-01), Troxell et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5177578 (1993-01-01), Kakinoki et al.
patent: 5219786 (1993-06-01), Noguchi
patent: 5244836 (1993-09-01), Lim
patent: 5248630 (1993-09-01), Serikawa et al.
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5278093 (1994-01-01), Yonehara
patent: 5352291 (1994-10-01), Zhang et al.
patent: 5354697 (1994-10-01), Oostra et al.
patent: 5358907 (1994-10-01), Wong
patent: 5387530 (1995-02-01), Doyle et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5480811 (1996-01-01), Chiang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5531182 (1996-07-01), Yonehara
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5696388 (1997-12-01), Funada et al.
patent: 5882960 (1999-03-01), Zhang et al.
patent: 5895933 (1999-04-01), Zhang et al.
patent: 5897347 (1999-04-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5949091 (1999-09-01), Yamaguchi
patent: 5956579 (1999-09-01), Yamazaki et al.
patent: 6084247 (2000-07-01), Yamazaki et al.
patent: 6335541 (2002-01-01), Ohtani et al.
patent: 6884698 (2005-04-01), Ohtani et al.
patent: 6998639 (2006-02-01), Ohtani et al.
patent: 0 390 608 (1990-10-01), None
patent: 0 612 102 (1994-08-01), None
patent: 0 631 325 (1994-12-01), None
patent: 58-68923 (1983-04-01), None
patent: 60-105216 (1985-06-01), None
patent: 63-142807 (1988-06-01), None
patent: 63-318162 (1988-12-01), None
patent: 64-074754 (1989-03-01), None
patent: 01-135014 (1989-05-01), None
patent: 01-206632 (1989-08-01), None
patent: 1-206632 (1989-11-01), None
patent: 01-276616 (1989-11-01), None
patent: 02-020059 (1990-01-01), None
patent: 2-119122 (1990-05-01), None
patent: 2-140915 (1990-05-01), None
patent: 02-143415 (1990-06-01), None
patent: 02-222546 (1990-09-01), None
patent: 02-260524 (1990-10-01), None
patent: 03-280420 (1991-12-01), None
patent: 4-011722 (1992-01-01), None
patent: 04-022120 (1992-01-01), None
patent: 04-318973 (1992-11-01), None
patent: 05-067635 (1993-03-01), None
patent: 05-067785 (1993-03-01), None
patent: 05-082442 (1993-04-01), None
patent: 07-058338 (1995-03-01), None
patent: WO 86/03621 (1986-06-01), None
patent: WO 92/01089 (1992-01-01), None
Helmenstine, Anne M. Phosphorus Facts, Chemical & Physical Properties of Phosphorus. About.com, 2010 [online]. Retrieved on Feb. 22, 2010. Retrieved from Internet: <URL: http://chemistry.about.com/od/elementfacts/a/phosphorus.htm?p=1>.
European Search Report (Application No. 01116025.6) dated Mar. 5, 2004.
C. Hayzelden et al., “In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon,” App. Phys. Lett., (Applied Physics Letters) vol. 60, No. 2, pp. 225-227.
S. P. Murarka, “Silicides for VLSI Applications,” 1983, pp. 82, 112.
A. V. Dvurechenskii et al., “Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3d Metals,” Phys. Stat. Sol., (a) 95 (1986), No. 2, pp. 635-640.
A. Yu. Kuznetsov et al., “Enhanced Solid Phase Epitaxial Recrystallization of Amorphous Silicon Due to Nickel Silicide Precipitation Resulting From Ion Implantation and Annealing,” Nucl. Instrum. Methods Phys. Res. B. Beam Interact. Mater. Atoms (Nuclear Instruments & Methods in Physics Research, Section B. Beam Interactions with Materials and Atoms, vol. 80-81. (1993), pp. 990-993.
S. Coffa et al. (eds.), “Metal-Enhanced Growth of Silicon,” Crucial Issues in Semiconductor Materials and Processing Technologies, 1992, Kluwer Academic Publishers, pp. 483-499.
Oki et al., Short Notes, “Effect of Deposited Metals on the Crystallization Temperature of Amorphous Germanium Film,”Jpn. J. Appl. Phys.No. 8, (1969), Jun. 2, 1969, p. 1056.
Ultra LSI Process Data Handbook, Apr. 15, 1982, pp. 124-125.
Batstone et al., “Microscopic Processes in Crystallization,” Solid State Phenomena, vols. 37-38, pp. 257-268.
Graef et al., “Enhanced Crystallinity of Silicon Films Deposited by CVD on Liquid Layers (CVDOLLProcess): Silicon on Tin Layers in the Presence of Hydrogen Chloride,” Journal of Applied Physics, vol. 48, No. 9, Sep. 1977, pp. 3937-3940.
Kakkad et al., “Crystallized Si Films by Low-Temperature Rapid Thermal Annealing of Amorphous Silicon,” J. Appl. Phys., vol. 65, No. 5, Mar. 1, 1989, pp. 2069-2072.
Kakkad et al., “Low Temperature Selective Crystallization of Amorphous Silicon,” Journal of Non-Crystalline Solids 115 (1989), pp. 66-68.
Liu et al., “Polycrystalline Silicon Thin Film Transistors on Corning 7059 Glass Substrates Using Short Time, Low-Temperature Processing,” Appl. Phys. Lett., vol. 62, No. 20, May 17, 1993, pp. 2554-2556.
Liu et al., “Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing,” Appl. Phys. Lett., vol. 55, No. 7, Aug. 14, 1989, pp. 660-662.
T. Hempel et al., “Needle-Like Crystallization of Ni Doped Amorphous Silicon Thin Films,” Solid State Communications, vol. 85, No. 11 (1993), pp. 921-924.
J. Stoemenos et al., “Crystallization of Amorphous Silicon by Reconstructive Transformation Utilizing Gold,” Appl. Phys. Lett., vol. 58, No. 11, Mar. 18, 1991, pp. 1196-1198.
C. Hayzelden et al., “Silicide Formation and Silicide-Mediated Crystallization of Nickel-Implanted Amorphous Silicon Thin Films,” J. Appl. Phys., vol. 73, No. 12, Jun. 15, 1993, pp. 8279-8289.
Y. Kawazu et al., “Initial Stage of the Interfacial Reaction between Nickel and Hydrogentaed Amorphous Silicon,” Japanese Journal of Applied Physics, vol. 29, No. 4, Apr. 1990, pp. 729-738.
L. Hultman et al., “Crystallization of Amorphous Silicon During Thin-Film Gold Reaction,” J. Appl. Phys. 62(9), Nov. 1, 1987, pp. 3647-3655.
T. Balaji Suresh, et al., “Electroless Plates Nickel Contacts to Hydrogenated Amorphous Silicon,” Thin Solid Films, 252 (1994), pp. 78-81.
M. Fuse et al., “Performance of Poly-Si Film Transistors Fabricated by Excimer-Laser Annealing of SiH4 and Si2H6-Source Low Pressure Vapor Deposited A Si Films with or Without Solid-Phase Crystallization,” Solid State Phenomena, vols. 37-38 (1994), pp. 565-570.
S. Caune et al., “Combined SW Laser and Furnace Annealing of Amorp

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