Method for manufacturing a semiconductor device

Details Method for manufacturing a semiconductor device Method for manufacturing a semiconductor device

1976-11-08

1978-07-25

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 148187, 156657, H01L 21306

Patent

active

041027329

ABSTRACT:
Semiconductor device elements are formed in a cavity portion on one main surface of a large diameter wafer, the cavity portion being protected by a frame body formed at the peripheral portion of the wafer. The semiconductor device elements are separated into individual semiconductor devices.

REFERENCES:
patent: 3160539 (1964-12-01), Hall et al.
patent: 3396317 (1968-08-01), Vendelin
patent: 3434019 (1969-03-01), Carley
patent: 3595716 (1971-07-01), Kerr et al.

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