Method for manufacturing a semiconductor chip bump having improv

Details Method for manufacturing a semiconductor chip bump having improv Method for manufacturing a semiconductor chip bump having improv

1994-02-08

1996-03-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437229, 437928, 22818022, 257737, 257738, 216 47, H01L 2144

Patent

active

054967708

ABSTRACT:
A connection bump of a semiconductor chip is formed by a photoresist pattern. The photoresist pattern is obtained through an exposure process by which photolithography solution layers of positive and/or negative type are repeatedly exposed and thereafter developed to obtain a photoresist pattern corresponding to the connection bump. Since the upper portion of the manufactured bump is no larger than the lower portion thereof, the bumps do not contact each other even though the upper portion of the bump is stretched due to a pressure induced during a process of bonding internal leads in a TAB package. The connection bump formed according to the present invention has a high aspect ratio, thereby preventing the internal leads from contacting the semiconductor chip surface and advantageously facilitating the removal of the photoresist pattern after the bump formation process to simplify overall manufacturing process.

REFERENCES:
patent: 3821785 (1974-06-01), Rose
patent: 4141731 (1979-02-01), Jarsen
patent: 4205099 (1980-05-01), Jones et al.
patent: 4293637 (1981-10-01), Hatada et al.
patent: 4880708 (1989-11-01), Sharma
patent: 5185055 (1993-02-01), Temple et al.
patent: 5298459 (1994-03-01), Arikawa et al.
patent: 5310699 (1994-05-01), Chikawa et al.

Affiliated with

Also associated with

Rating

Method for manufacturing a semiconductor chip bump having improv does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a semiconductor chip bump having improv, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor chip bump having improv will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1412825