Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-06-08
2011-10-18
Chen, Xiaoliang (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C361S280000, C029S852000, C257S275000, C257S306000, C257S310000, C257S532000, C257S778000, C438S096000, C438S166000, C438S197000, C438S240000, C438S455000, C438S458000, C438S627000
Reexamination Certificate
active
08039759
ABSTRACT:
A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.
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Chung Yul Kyo
Lee In Hyung
Lee Jung Won
Chen Xiaoliang
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
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