Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2006-01-27
2009-10-20
Ward, Jessica L (Department: 1793)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S180100, C228S262100, C228S225000, C438S612000, C257S777000, C257S778000
Reexamination Certificate
active
07604152
ABSTRACT:
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.
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Akamatsu Toshiya
Ochiai Masayuki
Uchida Hiroki
Fujitsu Limited
Fujitsu Patent Center
Saad Erin B
Ward Jessica L
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