Method for manufacturing a perpendicular sidewalled metal layer

Details Method for manufacturing a perpendicular sidewalled metal layer Method for manufacturing a perpendicular sidewalled metal layer

1986-04-18

1988-05-31

Schor, Kenneth

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156652, 1566611, 430314, 430317, H01L 21312, C25D 502

Patent

active

047479094

ABSTRACT:
A thick resist layer is formed on a thin metal film and the resist layer is dry-etched by using an SiO.sub.2 mask formed selectively on the resist layer, and a thick wiring metal layer is formed by plating method with using the dry-etched resist layer, which has perpendicular side walls as a mask, thereby to form a low resistance and fine-patterned wiring metal layer.

REFERENCES:
patent: 4029562 (1977-06-01), Feng et al.
patent: 4428796 (1984-01-01), Milgram
patent: 4498952 (1985-02-01), Christensen
Powell et al, "Vapor Deposition", John Wiley & Sons Inc., 1966, pp. 298-299.

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