Method for manufacturing a micromechanical sensor element

Details Method for manufacturing a micromechanical sensor element Method for manufacturing a micromechanical sensor element

2005-09-08

2009-08-11

Fulk, Steven J (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S419000, C257SE21216, C216S099000

Reexamination Certificate

active

07572661

ABSTRACT:
Described is a method for manufacturing a micromechanical sensor element and a micromechanical sensor element manufactured in particular using such a method which has a hollow space or a cavity and a membrane for detecting a physical variable. Different method steps are performed for manufacturing the sensor element, among other things, a structured etch mask having a plurality of holes or apertures being applied on a semiconductor substrate. Moreover, an etch process is used to create depressions in the semiconductor substrate beneath the holes in the structured etch mask. Anodization of the semiconductor material is subsequently carried out, the anodization taking place preferably starting from the created depressions in the semiconductor substrate. Due to this process, porous areas are created beneath the depressions, a lattice-like structure made of untreated, i.e., non-anodized, substrate material remaining between the porous areas and the depressions. This lattice-like structure extends preferably from the surface of the semiconductor into the depth. The etch mask for creating the depressions may be removed, optionally prior to or subsequent to the anodization. A temperature treatment is carried out for creating the hollow space and the membrane in the semiconductor substrate which forms the sensor element. During this process, the hollow space is created from the at least one area that has been rendered porous beneath a depression and the membrane above the hollow space is created from the lattice-like structure by rearranging the semiconductor material.

REFERENCES:
patent: 6670257 (2003-12-01), Barlocchi et al.
patent: 7045382 (2006-05-01), Benzel et al.
patent: 7052623 (2006-05-01), Becker et al.
patent: 7276277 (2007-10-01), Artmann et al.
patent: 7479232 (2009-01-01), Benzel et al.
patent: 2002/0086551 (2002-07-01), Beetz et al.
patent: 2002/0151100 (2002-10-01), Coffa et al.
patent: 2003/0116813 (2003-06-01), Benzel et al.
patent: 2004/0152228 (2004-08-01), Benzel et al.
patent: 100 30 352 (2002-01-01), None
patent: 100 32 579 (2002-01-01), None
patent: 101 14 036 (2002-10-01), None
patent: 102004036035 (2005-07-01), None
patent: 1 043 770 (2000-10-01), None
patent: WO00/23376 (2000-04-01), None
patent: 02/02458 (2002-01-01), None
patent: WO02/076880 (2002-10-01), None

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