Method for manufacturing a micro-electronic component having an

Details Method for manufacturing a micro-electronic component having an Method for manufacturing a micro-electronic component having an

1994-07-15

1996-05-14

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566571, 15666111, 437228, H01J 902

Patent

active

055164048

ABSTRACT:
A method for manufacturing an electrically conductive tip for field emission cathodes of vacuum electronic components includes forming the tip of doped silicon by molecular beam epitaxy of doped silicon through an opening of a mask and onto a substrate of monocrystalline silicon. The molecular beam epitaxy also produces a doped silicon layer on the surface of the mask.

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patent: 5313484 (1994-05-01), Arimoto
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