Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-15
2008-07-15
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S031000, C438S042000, C438S118000, C438S455000, C438S456000, C438S459000, C257SE21122, C216S002000
Reexamination Certificate
active
10821263
ABSTRACT:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
REFERENCES:
patent: 6143583 (2000-11-01), Hays
patent: 6504253 (2003-01-01), Mastromatteo et al.
patent: 6638836 (2003-10-01), Murari et al.
patent: 6689627 (2004-02-01), Mottura et al.
patent: 6713367 (2004-03-01), Solgaard et al.
patent: 6758983 (2004-07-01), Conant et al.
patent: 6794271 (2004-09-01), Harris et al.
patent: 6872319 (2005-03-01), Tsai
patent: 6984571 (2006-01-01), Enquist
patent: 2004/0077154 (2004-04-01), Nagarajan et al.
patent: 2004/0152229 (2004-08-01), Najafi et al.
patent: 2005/0048688 (2005-03-01), Patel et al.
patent: 2005/0095813 (2005-05-01), Zhu et al.
patent: 2006/0057836 (2006-03-01), Nagarajan et al.
patent: 10-289876 (1998-10-01), None
Korean Office Action dated Dec. 16, 2004 (and English translation of relevant portion).
Baldo Lorenzo
Del Sarto Marco
Marchi Mauro
Sassolini Simone
Bennett II Harold H.
Fourson George
Jorgenson Lisa K.
Seed IP Law Group PLLC
STMicroelectronics S.R.L.
LandOfFree
Method for manufacturing a micro-electro-mechanical device,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a micro-electro-mechanical device,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a micro-electro-mechanical device,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3948379