Method for manufacturing a laminated plate used in a semiconduct

Details Method for manufacturing a laminated plate used in a semiconduct Method for manufacturing a laminated plate used in a semiconduct

1993-10-07

1994-08-16

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156629, 156645, 156656, 156901, B44C 122, C23F 100

Patent

active

053383923

ABSTRACT:
In a method for manufacturing a laminated plate used in a semiconductor device according to the present invention, a conductive member is processed to form a frame and a wiring pattern supported by the frame integrally with each other, the wiring pattern is bonded to the major surface of a base member by high-temperature heating, using the frame as a guide, thereby to form a laminated layer, and the frame is removed from the laminated layer to form a desirable laminated plate.

REFERENCES:
patent: 3993411 (1976-11-01), Babcock et al.
patent: 5062916 (1991-11-01), Aufderheide et al.
patent: 5240551 (1993-08-01), Matsumura et al.

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