Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-06-02
1987-10-27
Lindsay, Robert L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
148 614R, 156278, 156638, 156666, 156902, B44C 122
Patent
active
047027932
ABSTRACT:
A sulfuroxy acid reducing agent composition can be used to treat the metallic conductive pathways formed in or on the surface of printed wiring boards in order to assure that the copper pathways are firmly and securely bonded to laminate layers of layered printed wiring board articles. The sulfuroxy acid reducing agent treatment promotes the rapid formation of a uniform metal oxide layer on the printed wiring board conductive pathways, when the printed circuit boards are exposed to an oxiding agent, which insures that the compositions used in forming the printed wiring board laminates do not interact with the active copper metal preventing delamination.
REFERENCES:
patent: 2364993 (1944-12-01), Meyer
patent: 2460896 (1949-02-01), Meyer
patent: 2460898 (1949-02-01), Meyer
patent: 2481854 (1949-09-01), MacMahon
patent: 2964436 (1960-12-01), Mikulis et al.
patent: 3137600 (1964-06-01), Margulies et al.
patent: 3293109 (1966-12-01), Luce
patent: 3434889 (1969-03-01), Haroldson et al.
patent: 3455775 (1969-07-01), Pohl et al.
patent: 3544389 (1970-12-01), Vazlrani
patent: 3657023 (1972-04-01), Grunwald et al.
patent: 3677828 (1972-07-01), Caule
patent: 4063984 (1977-12-01), Critchley
patent: 4409037 (1983-10-01), Landau
patent: 4411710 (1983-10-01), Mochizuki et al.
Garlough Greg D.
Heikkila Kurt E.
ETD Technology Inc.
Lindsay Robert L.
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