Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-04-11
2011-12-27
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S638000, C438S689000, C257SE21577, C257SE21579
Reexamination Certificate
active
08084357
ABSTRACT:
A method for manufacturing a multi cap layer includes providing a substrate, forming a multi cap layer comprising a first cap layer and a second cap layer formed thereon on the substrate, forming a patterned metal hard mask layer on the multi cap layer, and performing an etching process to etch the multi cap layer through the patterned hard mask layer and to form an opening in the second cap layer.
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Chen Mei-Ling
Chen Wei-Chih
Chiou Jiann-Jen
Hsu Feng-Yu
Huang Chun-Chieh
Hsu Winston
Margo Scott
Nguyen Khiem D
United Microelectronics Corp.
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