Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2004-12-13
2009-08-04
Fulk, Steven J (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257S419000, C257SE21215, C216S099000
Reexamination Certificate
active
07569412
ABSTRACT:
A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.
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Armbruster Simon
Benzel Hubert
Brasas Joerg
Lammel Gerhard
Schaefer Frank
Fulk Steven J
Kenyon & Kenyon LLP
Robert & Bosch GmbH
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