Method for manufacturing a curved surface multi-layer wiring boa

Details Method for manufacturing a curved surface multi-layer wiring boa Method for manufacturing a curved surface multi-layer wiring boa

1993-11-15

1995-10-31

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 430327, 430330, 428901, 216 20, G03F 700, H05K 306

Patent

active

054628385

ABSTRACT:
A method for manufacturing a curved surface multi-layer wiring board having the through-holes and high accurate inner patters with a high reliability. A curved surface multi-layer wiring board is manufactured by processes for forming the inner pattern on the copper clad substrates, and for perforating the holes to the substrates and prepregs, and for laying-up these substrates and prepregs, then for pressing these substrates and prepregs in the formation mould. Then the outer pattern are formed by the laser exposure process after the through holes are connected between the layers. A method is also provided for repeating the laying-up processes in order to obtain a curved surface multi-layer wiring board of which is a three dimensional curved surface.

REFERENCES:
patent: 3799802 (1974-03-01), Schneble
patent: 4106187 (1978-08-01), Smith
patent: 4258468 (1981-03-01), Balde
patent: 4521262 (1985-06-01), Pellegrino
patent: 4716259 (1987-12-01), Tokura
patent: 4922257 (1990-05-01), Saito et al.

Affiliated with

Also associated with

Rating

Method for manufacturing a curved surface multi-layer wiring boa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a curved surface multi-layer wiring boa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a curved surface multi-layer wiring boa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1771496