Method for manufacturing a curved surface multi-layer wiring boa

Details Method for manufacturing a curved surface multi-layer wiring boa Method for manufacturing a curved surface multi-layer wiring boa

1993-08-24

1995-09-12

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 430327, 430330, 428901, 216 20, G03F 724

Patent

active

054495911

ABSTRACT:
A method for manufacturing a curved surface multi-layer wiring board having highly accurate inner patterns with high reliability. A curved surface multi-layer wiring board is manufactured by providing and pressing a prepreg to form a curved surface, and by plating a copper film on the curved surface. Outer patterns are formed on the copper film. The outer patterns may be formed by a laser exposure process after through-holes are connected between the layers. A method is also provided for repeating the process to obtain a curved surface multi-layer wiring board which has a three dimensional curved surface.

REFERENCES:
patent: 3799802 (1974-03-01), Schneble
patent: 4106187 (1978-08-01), Smith
patent: 4258468 (1981-03-01), Balde
patent: 4388388 (1983-06-01), Kornbau
patent: 4521262 (1985-06-01), Pellegrino
patent: 4716259 (1987-12-01), Tokura
patent: 4835087 (1989-05-01), Bielli
patent: 4922257 (1990-05-01), Saito et al.

Affiliated with

Also associated with

Rating

Method for manufacturing a curved surface multi-layer wiring boa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a curved surface multi-layer wiring boa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a curved surface multi-layer wiring boa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-404710