Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-04-02
1991-02-19
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156653, 156655, 156657, 1566591, 156662, 437129, 437133, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
049941437
ABSTRACT:
A method for manufacturing a buried heterostructure laser diode comprising an active layer and a clad layer which are formed as a reverse mesa on a substrate, current blocking layers and an insulation layer deposited on the top of the blocking layers, and an electrode formed on the top thereof comprising: a first step for forming a SiO.sub.2 stripe mask on the clad layer after a first liquid phase epitaxial growth of the active layer and the clad layer on the substrate, a second step for etching the clad layer under the SiO.sub.2 stripe mask using an etchant to form a reverse mesa structure, a third step for selectively etching the clad layer using an etchant such as a family of hydrochloric acid and then for making the active layer protrude, and a fourth step for naturally melthig back the protruded porting of the active layer surface during the second epitaxial growth process is provided.
REFERENCES:
patent: 4648940 (1987-03-01), Menigaux et al.
patent: 4662988 (1987-05-01), Renner
patent: 4692206 (1987-09-01), Kaneiwa et al.
patent: 4784722 (1988-11-01), Liau et al.
Electronics and Telecommunications Research Institute
Korea Telecommunication Authority
Powell William A.
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