Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-01-08
1986-08-05
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29846, 156631, 156634, 156645, 156656, 156902, 156150, 156233, 174 685, 427 96, 430314, 430315, 430318, C23F 102, B44C 122, B05D 512, C25D 502
Patent
active
046041605
ABSTRACT:
This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.
Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.
REFERENCES:
patent: 3181986 (1965-05-01), Pritikin
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4354895 (1982-10-01), Ellis
patent: 4465538 (1984-08-01), Schmoock
Akahoshi Haruo
Kanechiku Minoru
Kawakubo Kyoji
Kawamoto Mineo
Matsuda Yoichi
Hitachi , Ltd.
Powell William A.
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