Method for manufacture of printed circuit boards

Details Method for manufacture of printed circuit boards Method for manufacture of printed circuit boards

1987-12-14

1989-02-21

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156901, 29847, 29852, C23F 100, B44C 122, C03C 1500

Patent

active

048062006

ABSTRACT:
A method of preparing printed circuit boards is described in which the solder mask is applied over a thin layer of copper oxide covering the copper circuit traces, the copper oxide layer being that which remains after stripping the tin or tin-lead alloy etch resist.

REFERENCES:
patent: 3677949 (1972-07-01), Brindisi
patent: 4127438 (1978-11-01), Babcock
patent: 4144118 (1979-03-01), Stahl
patent: 4409037 (1983-10-01), Landau
patent: 4487654 (1984-12-01), Coppin
patent: 4687545 (1987-08-01), Williams

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