Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1986-09-03
1989-02-14
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430318, 430319, 430329, 427 97, 427 98, 204 15, 1566591, 156666, G03C 500
Patent
active
048046159
ABSTRACT:
Printed circuit boards having solder coated pads and through-holes and bare copper traces protected by a directly applied solder mask or by a coating of non-reflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists are applied to circuit boards having tin-lead over copper plated holes and pads so as to define and etch-protect bare copper traces of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist and tin-lead plating are etched away, the etch-resist removed and solder mask applied over the bare copper traces or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.
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patent: 4291118 (1981-09-01), Boduch et al.
patent: 4325780 (1982-04-01), Schulz
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patent: 4487654 (1984-12-01), Coppin
patent: 4735694 (1988-04-01), Kukanskis
Fefferman, "UV-Curable Solder Mask . . . ", Proc. Electr/Electron Insul. Conf., 1977, vol. 13, pp. 97-101.
Duffek, "PC Processing Using Solder Mask over Tin-Nickel", Electronic Packaging and Production, Jun. 1979, pp. 71-74.
Castaldi Steven A.
Larson Gary B.
Ruszczyk Stanley J.
Dees Jos,e G.
MacDermid Incorporated
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